For horizontal and vertical installation; prepared for telescopic rails; 19" mounting bracket can be removed externally; tower kit (optional)

Rack PC, 19", 4U

100/240 V AC (autorange) 50 / 60 Hz; optional redundant 100 - 240 V AC

Yes

Yes

20 ms

Xeon E3-1275 v5 (4C/8T, 3.6 (4.0) GHz, 8 MB Cache); Core i7-6700 (4C/8T, 3.4 (4.0) GHz, 8 MB Cache); Core i5-6500 (4C/4T, 3.2 (3.6) GHz, 6 MB Cache); Pentium G4400 (2C/2T, 3.3 GHz, 3 MB Cache)

Intel C236 / Intel H110

Onboard Intel HD graphics P530 / 530 /510 integrated in processor; graphics card PCIe (x16) (dual head: 2x VGA or 2x DVI-D) (optional)

DVD±R/RW (SlimLine)

Internal installation: 1 TB HDD, 2x 1 TB HDD, RAID1 (2x 1 TB HDD), RAID1 (2x 1 TB HDD (Enterprise)); for front mounting in low-profile removable drive bay trays (hot-swap in RAID configuration): 1 TB HDD, 2x 1 TB HDD, RAID1 (2x 1 TB HDD), RAID1 (2x 1 TB HDD (Enterprise)), RAID1 (2x 2 TB HDD (Enterprise)), RAID1 (2x 2 TB HDD (Enterprise)) + 1x 2 TB HDD (Enterprise) as hot spare, RAID1 (2x 2 TB HDD (Enterprise)) + 1x 480 GB SSD, RAID5 (3x 2 TB HDD (Enterprise)), RAID5 (3x 2 TB HDD (Enterprise)) + 1x 2 TB HDD (Enterprise) as hot spare

Yes; 1x 240 GB, 1x 480 GB SSD, 2x 480 GB SSD, RAID1 (2x 480 GB SSD)

Mounted internally in vibration/shock-absorbing hard disk support, or mounted at the front in the low-profile removable drive bay (hot-swap in RAID configurations)

4 GB to 64 GB DDR4 2133 SDRAM

64 Gbyte

7 spare slots for expansions (all long); mainboard with H110 chipset: 1x PCIe (x16) Gen 3, 1x PCIe (x16) (1 lane) Gen 2, 1x PCIe (x8) (1 lane) Gen 2, 1x PCIe (x4) (1 lane) Gen 2, 1x PCIe (x4) (1 lane) Gen 2, 2x PCI; mainboard with C236 chipset: 1x PCIe (x16) Gen 3, 1x PCIe (x16) (4 lanes) Gen 3, 1x PCIe (x8) (1 lane) Gen 3, 1x PCIe (x4) (4 lane) Gen 3, 1x PCIe (x4) (1 lane) Gen 3, 2x PCI

Interfaces mainboard (H110 chipset): 2x Intel Gigabit Ethernet (RJ45, teaming-capable), 4x USB 3.0: 2x on rear, 2x on front, 4x USB 2.0: 4x on rear, 1x DisplayPort V1.2, 1x DVI-D, 2x PS/2, audio: Line in, line out, micro; interfaces mainboard (C236 chip set): 2x Intel Gigabit Ethernet (RJ45, teaming-capable), 6x USB 3.0: 4x on rear, 2x on front, 5x USB 2.0: 4x on rear, 1x internal e.g. for software dongle with optional interlock, 2x DisplayPort V1.2, 1x DVI-D, 1x COM1, 2x PS/2, audio: line in, line out, micro

Mainboard (H110 chipset): 4x USB 3.0: 2x on rear, 2x on front, 4x USB 2.0: 4x on rear; mainboard (C236 chipset): 6x USB 3.0: 4x on rear, 2x on front, 5x USB 2.0: 4x on rear, 1x internal e.g. for software dongle with optional interlock

2x PS/2

COM1: 1x RS 232, COM2 (optional): 1x RS 232

optional LPT1

2x DisplayPort and 1x DVI-D onboard; 1x VGA via DP-VGA adapter cable (optional); graphics card PCIe (x16), Dual Head (2x VGA or 2x DVI-D), 1 GB graphics memory (optional)

2 x Ethernet (RJ45)

Yes

Yes

Yes

Yes

POWER, HDD, TEMP, FAN, HDD0 ALARM, HDD1 ALARM, HDD2 ALARM, HDD3 ALARM

Yes

Optional

±4 kV contact discharge acc. to IEC 61000-4-2; ±8 kV air discharge acc. to IEC 61000-4-2

10 V/m for 80 - 1000 MHz, 80% AM acc. to IEC 61000-4-3; 3 V/m for 1.4 - 2 GHz, 80% AM acc. to IEC 61000-4-3; 1 V/m for 2 - 2.7 GHz, 80% AM acc. to IEC 61000-4-3; 10 V for 150 kHz - 80 MHz, 80% AM acc. to IEC 61000-4-6

±2 kV acc. to IEC 61000-4-4, burst; ±1 kV acc. to IEC 61000-4-5, surge symmetric; ±2 kV acc. to IEC 61000-4-5, surge asymmetric

±2 kV acc. to IEC 61000-4-4, burst; ±2 kV acc. to IEC 61000-4-5, surge

±1 kV acc. to IEC 61000-4-4, Burst

±2 kV acc. to IEC 61000-4-5, surge asymmetric

±1 kV acc. to IEC 61000-4-5, surge symmetric

30 A/m; to IEC 61000-4-8

EN 61000-6-3, FCC Class A, EN 61000-6-4, CISPR 22, EN 55022 Class B, EN 61000-3-2 Class D, EN 61000-3-3

IP30

IP20

CE, cULus 60950, KCC

Yes; For use in industrial areas as well as domestic, business and commercial environments (emitted interference: EN 61000-6-3:2007 +A1:2011, noise immunity: EN 61000-6-2:2005)

Yes; Included in cULus

Yes

Yes; UL 60950-1, file number E115352

Yes

Yes

Yes

CE, EN 61000-6-3:2007 +A1:2011, EN 61000-6-2:2005

With front door closed: G2 EN 779, 99% of particles > 0.5 mm are filtered

0 °C to +40 °C in full configuration (no burner mode), at +5 °C to +35 °C without limitation

0 °C

40 °C

-20 °C

60 °C

Tested according to IEC 60068-2-78, IEC 60068-2-30: Operation: 5 % to 85 % at 30 °C (no condensation), storage / transport: 5 % to 95 % at 25 / 55 °C (no condensation)

Tested according to IEC 60068-2-6, 10 cycles; 20 to 58 Hz: 0.015 mm; 58 to 200 Hz: 2 m/sІ (0.2 g)

Tested according to IEC 60068-2-27; half-sine: 9.8 m/sІ (1 g), 20 ms, 100 shocks per axis

Yes

Multi-Language User Interface (MUI): 5 languages (English, German, French, Spanish, Italian)

Yes

Optionally in package with SIMATIC WinCC or WinCC flexible

430 mm

177 mm; 4U

446 mm; Device with short enclosure: 356 mm