Design and equipment features

Design

19" rack

4 U

2 U

4 U

Ready for telescopic rails​

Yes

Yes

Yes

Horizontal/vertical installation

Yes/Yes

Yes/No

Yes/Yes

19" fixing bracket with handle; dismountable from outside

Yes

Yes

Yes

Tower kit (accessory)

Yes

No

Yes

Degree of protection

IP30 at front (front door closed); IP20 at the rear according to EN 60529

IP41 at front (front door closed); IP20 at the rear according to EN 60529

IP41 at front (front door closed); IP20 at the rear according to EN 60529

Dust protection

With closed front door in conformity with IEC 60529

Filter class G2 EN 779, particles > 0.5 mm are blocked by 99%

With closed front door in conformity with IEC 60529

Filter class G2 EN 779, particles > 0.5 mm are blocked by 99%

With closed front door in conformity with IEC 60529

Filter class G2 EN 779, particles > 0.5 mm are blocked by 99%

Chipset

Intel C236 (GL82C236 PCH)

Intel C226 (DH82C226 PCH)

Intel C226 (DH82C226 PCH)

CPU

Processor, clock

• Intel Xeon Processor E3‑1275 v5 4C/8T, 3.6 (4.0) GHz, 8 MB cache, iAMT
• Intel Core i7-6700 4C/8T, 3.4 (4.0) GHz, 8 MB cache, iAMT
• Intel Core i5-6500 4C/4T, 3.2 (3.6) GHz, 6 MB cache, iAMT

• Intel Xeon E3‑1268L v3, 4 cores, 8 threads, 2.3 (3.3) GHz, GT2, 8 MB cache, Turbo Boost, VT‑d, iAMT
• Intel Core i5‑4570TE, 2 cores, 4 threads, 2.7 (3.3) GHz, GT2, 4 MB cache, Turbo Boost, VT‑d, iAMT
• Intel Core i3‑4330TE, 2 cores, 4 threads, 2.4 GHz, GT2, 4 MB cache

• Intel Xeon E3‑1268L v3, 4 cores, 8 threads, 2.3 (3.3) GHz, GT2, 8 MB cache, Turbo Boost, VT‑d, iAMT
• Intel Core i5‑4570TE, 2 cores, 4 threads, 2.7 (3.3) GHz, GT2, 4 MB cache, Turbo Boost, VT‑d, iAMT
• Intel Core i3‑4330TE, 2 cores, 4 threads, 2.4 GHz, GT2, 4 MB cache

Main memory (SDRAM)

Type

DDR4-2133 SDRAM (PC4‑2400T)

DDR3-1600 SDRAM (PC3‑12800), with or without ECC

DDR3-1600 SDRAM (PC3‑12800), with or without ECC

Maximum configuration

4 DIMM memory sockets in total; together up to 64 GB

4 DIMM memory sockets in total; together up to 32 GB

4 DIMM memory sockets in total; together up to 32 GB

Standard configuration

4 GB DDR4-2133 SDRAM (1 Г— 4 GB); single channel

8 GB DDR4-2133 SDRAM (2 Г— 4 GB); dual channel

16 GB DDR4-2133 SDRAM (2 Г— 8 GB); dual channel

32 GB DDR4-2133 SDRAM (2 Г— 16 GB); dual channel

64 GB DDR4-2133 SDRAM (4 Г— 16 GB); dual channel

8 GB or more can be selected for OS server or ES/OS single station

4 GB or more can be selected for OS client

4 GB DDR3 SDRAM (2 Г— 2 GB); dual channel

4 GB DDR3 SDRAM (1 Г— 4 GB); single channel, ECC

8 GB DDR3 SDRAM (2 Г— 4 GB); dual channel (without/with ECC)

16 GB DDR3 SDRAM (2 Г— 8 GB); dual channel (without/with ECC)

32 GB DDR3 SDRAM (4 Г— 8 GB); dual channel (without/with ECC)

8 GB or more can be selected for OS server or ES/OS single station

4 GB and more can be selected for OS client

8 GB DDR3 SDRAM (2 Г— 4 GB); dual channel (without/with ECC)

16 GB DDR3 SDRAM (2 Г— 8 GB); dual channel (without/with ECC)

32 GB DDR3 SDRAM (4 Г— 8 GB); dual channel (without/with ECC)

8 GB or more can be selected for OS server or ES/OS single station

Motherboard slots

Total of 7 slots:

• 2 Г— PCI
  1 Г— PCIe x4 (1 lane, Gen 3.0)
  1 Г— PCIe x4 (4 lanes, Gen 3.0)
  1 Г— PCIe x8 (1 lane, Gen 3.0)
  1 Г— PCIe x16 (4 lanes, Gen 3.0)
  1 Г— PCIe x16; Gen 3.0

Modules up to 312 mm in length can be used

Selectable bus modules with total of 4 slots:

• 2 Г— PCIe x16 (8 lanes, Gen 3.0) and 2 Г— PCI
• 1 Г— PCIe x16 (8 lanes, Gen 3.0), 1 Г— PCIe x16 (4 lanes, Gen 2.0); 2 Г— PCIe x16 (4 lanes, Gen 3.0)

Modules up to 312 mm in length can be used

Bus module with total of 11 slots:

1 Г— PCIe x16 (8 lanes, Gen 3.0)
2 Г— PCIe x16 (4 lanes, Gen 3.0)
2 Г— PCIe x16 (4 lanes, Gen 2.0)
3 Г— PCIe x4 (4 lanes, Gen 2.0)
3 Г— PCI

Modules up to 312 mm in length can be used

Possible slots for SATA drives

On the front

Alternative for HDD/SSD:

1 Г— 5.25" + 3 Г— slimline removable trays 3.5" or 4 Г— slimline removable trays 3.5"

1 Г— 3.5" (slimline) for DVD burner

2 Г— slimline removable drive bay 3.5" for HDD/SSD

1 Г— 3.5" (slimline) for DVD burner

4 Г— slimline removable drive bay 3.5" for HDD/SSD

1 Г— 3.5" (slimline) for DVD burner

Indoors

2 Г— 3.5" for HDD/SSD

2 Г— 3.5" for HDD (in shock and vibration-damped drive cage; alternative to removable drive bay)

2 Г— 3.5" for HDD in shock and vibration-damped drive cage

2 Г— 3.5" for HDD/SSD, integral

RAID controller

Onboard RAID controller

Intel PCH with Intel Rapid Storage Technology

Intel 8 series SATA RAID controller

Intel 8 series SATA RAID controller

• RAID 1 (SATA HDD)

Yes

Yes

Yes

• RAID 1 (SATA SSD)

Yes

Yes

Yes

Hardware RAID controller (PCI x8; 2 slots occupied)

• RAID 1 (SAS HDD)

No

Yes

Yes

• RAID 5 (SAS HDD)

No

No

Yes

Drives

Hard disk drive (HDD) 3.5", 6 Gbps, NCQ technology

• ES/OS Single station or OS Server

1 TB;
Enterprise type: 1 TB or 2 TB

500 GB SATA, 1 TB SATA or 1 TB SAS

500 GB SATA, 1 TB SATA or 1 TB SAS

• OS client

1 TB;
Enterprise type: 1 TB or 2 TB

500 GB or 1 TB SATA

500 GB or 1 TB SATA

Solid State Drive (SSD) 2.5"

• ES/OS Single station or OS Server

240 GB or 480 GB SATA (eMLC)

240 GB or 480 GB SATA (eMLC)

240 GB or 480 GB SATA (eMLC)

• OS client

240 GB or 480 GB SATA (eMLC)

240 GB or 480 GB SATA (eMLC)

–

DVD burner

DVD±R/RW 5.25" SATA Slimline

Read:

• DVD‑ROM: single layer and dual layer 8x
• DVD‑R/+R 8x
• DVD‑RW/+RW 8x
• DVD‑RAM 8x
• CD-ROM, CD‑R 24x, CD‑RW 24x

Write:

• DVD+R 8x,
  DVD+R DL 6x
  DVD+RW 8x,
  DVD‑R 8x,
  DVD‑R DL 6x
  DVD‑RW 6x
• DVD-RAM 5x
• CD‑R 10x, CD‑RW 16x

DVD±R/RW 5.25" SATA Slimline

Read:

• DVD‑ROM: single layer 8x, dual layer 6x
• DVD-R/+R: single layer 8x, dual layer 6x
• DVD‑RW/+RW 8x
• DVD‑RAM 5x
• CD‑R 24x, CD‑RW 24x

Write:

• DVD+R 8x, DVD+RW 8x, DVD‑R 8x, DVD‑RW 6x
• DVD+R9 (DL) 6x, DVD‑R DL 2x
• CD‑R 24x, CD‑RW 24x

DVD±R/RW 5.25" SATA Slimline

Read:

• DVD‑ROM: single layer 8x, dual layer 6x
• DVD-R/+R: single layer 8x, dual layer 6x
• DVD‑RW/+RW 8x
• DVD‑RAM 5x
• CD‑ROM, CD‑R 24x, CD‑RW 24x

Write:

• DVD+R 8x, DVD+RW 8x, DVD‑R 8x, DVD‑RW 6x
• DVD+R (DL) 6x, DVD‑R DL 2x
• CD‑R 24x, CD‑RW 24x

HDD/SSD configuration

HDD (single station, server or client)

• 1 TB HDD SATA internal (optionally Enterprise type) 0.2 g vibration, 1 g shock
• 1 TB HDD SATA in removable tray, at the front (optionally Enterprise type)
• 1 TB RAID 1 internal; 0.2 g vibration, 1 g shock (2 Г— 1 TB HDD SATA, optionally Enterprise type, data mirroring)
• 1 TB RAID 1 in removable trays; hot-swap; at the front (2 Г— 1 TB HDD SATA, optionally Enterprise type, data mirroring)
• 2 TB RAID 1 in removable trays; hot-swap; at the front (2 Г— 2 TB HDD SATA, Enterprise type, data mirroring)
• 2 TB RAID 1 (2 Г— 2 TB HDD SATA, data mirroring) plus 2 TB hot-spare HDD SATA; each Enterprise type; in removable trays; hot-swap; at the front

SSD (single station, server or client)

• 240 GB or 480 GB SSD SATA internal
• 240 GB or 480 GB SSD SATA in removable tray; at the front
• 240 or 480 GB RAID 1 (2 Г— 240/480 GB SSD SATA) in removable trays, hot-swap, at the front

HDD+SSD (single station or server)

• 2 TB RAID 1 (2 Г— 2 TB HDD SATA, Enterprise type, data mirroring), hot-swap, plus 480 GB SSD SATA; each in removable trays; at the front

HDD (single station, server or client)

• 500 GB or 1 TB HDD SATA, internal; 0.5 g vibration, 5 g shock
• 500 GB or 1 TB HDD SATA in removable drive bay; at the front
• 1 TB RAID 1 internal; 0.5 g vibration, 5 g shock (2 Г— 1 TB HDD SATA, data mirroring)
• 1 TB RAID 1 in removable drive bay; for hot swapping; at the front, data mirroring (2 Г— 1 TB HDD SATA)

HDD (single station or server)

• 1 TB RAID 1 in removable drive bay; for hot swapping; at the front, data mirroring (2 Г— 1 TB HDD SAS)

SSD (single station, server or client)

• 240 GB or 480 GB SSD SATA internal
• 240 GB or 480 GB SSD SATA in removable drive bay; at the front
• RAID 1 SSD SATA in removable drive bay; for hot swapping; at the front, data mirroring; (single station or server)
  • 240 GB (2 Г— 240 GB)
  • 480 GB (2 Г— 480 GB)

HDD+SSD (single station or server)

• 1 TB RAID 1 internal; 0.5 g vibration, 5 g shock (2 Г— 1 TB HDD SATA, data mirroring) plus 240 GB SSD SATA, internal, in the DVD drive slot
• 1 TB RAID1 in removable drive bay; for hot swapping; at the front, data mirroring (2 Г— 1 TB HDD SATA or 2 Г— 1 TB HDD SAS) plus 240 GB SSD SATA, internal, in the DVD drive slot

HDD (single station or server)

• 500 GB or 1 TB HDD SATA, internal; 0.5 g vibration, 5 g shock
• 500 GB or 1 TB HDD SATA in removable drive bay; at the front
• 1 TB RAID 1 internal; 0.5 g vibration, 5 g shock (2 Г— 1 TB HDD SATA, data mirroring)
• 1 TB RAID 1 in removable drive bay; for hot swapping; at the front, data mirroring (2 Г— 1 TB HDD SATA or 2 Г— 1 TB HDD SAS)
• 1 TB RAID 1 (2 Г— 1 TB HDD SATA, data mirroring) plus 1 TB hot-spare HDD SATA; each in removable drive bay; for hot swapping; at the front
• 2 TB RAID 5 in removable drive bay; for hot swapping; at the front, (3 Г— 1 TB HDD SAS, striping with parity)
• 2 TB RAID 5 (3 Г— 1 TB HDD SAS, striping with parity) plus 1 TB hot-spare HDD SAS; each in removable drive bay; for hot swapping; at the front

SSD (single station or server)

• 240 GB or 480 GB SSD SATA internal
• 240 GB or 480 GB SSD SATA in removable drive bay; at the front
• RAID 1 SSD SATA in removable drive bay; for hot swapping; at the front, data mirroring
  • 240 GB (2 Г— 240 GB)
  • 480 GB (2 Г— 480 GB)

HDD+SSD (single station or server)

• 1 TB RAID 1 internal; 0.5 g vibration, 5 g shock (2 Г— 1 TB HDD SATA, data mirroring) plus 240 GB SSD SATA, in removable drive bay, at the front
• 1 TB RAID 1 (2 Г— 1 TB HDD SATA or 2 Г— 1 TB HDD SAS; data mirroring, for hot swapping) plus 240 GB SSD SATA, each in removable drive bay; at the front
• 2 TB RAID 5 (3 Г— 1 TB HDD SAS, striping with parity, for hot swapping) plus 240 GB SSD SATA, each in removable drive bay; at the front

Graphics card

Onboard Intel graphics controller, integrated in processor; version depends on processor, either HD Graphics 530 (i7‑6700 and i5‑6500) or HD Graphics P530 (E3‑1275 v5)

Onboard Intel graphics controller HD Graphics P4600/P4700; 2‑D and 3‑D engine integrated in processor

Onboard Intel graphics controller HD Graphics P4600/P4700; 2‑D and 3‑D engine integrated in processor

Graphics memory

Dynamic Video Memory Technology (uses between 32 MB and 1.7 GB RAM)

Dynamic Video Memory Technology (uses between 32 MB and 1.7 GB RAM)

Dynamic Video Memory Technology (uses between 32 MB and 1.7 GB RAM)

Resolutions. frequencies, colors

• VGA connection

Up to 2560 Г— 1600 at 60 Hz, 32-bit color depth (DisplayPort to VGA via adapter cable)

Up to 2560 Г— 1600 at 120 Hz, 32-bit color depth (DVI‑I to VGA or DisplayPort to VGA via adapter cable)

Up to 2560 Г— 1600 at 120 Hz, 32-bit color depth (DVI‑I to VGA or DisplayPort to VGA via adapter cable)

• DVI connection

Up to 1920 Г— 1200 at 60 Hz, 32-bit color depth

Up to 2048 Г— 1152 at 60 Hz, 32-bit color depth

Up to 2048 Г— 1152 at 60 Hz, 32-bit color depth

• DisplayPort

Up to 4096 Г— 2304 at 60 Hz, 32-bit color depth

Up to 4096 Г— 2160 at 24 Hz, 32-bit color depth

Up to 4096 Г— 2160 at 24 Hz, 32-bit color depth

Interface modules, interfaces

Terminal bus interface

2 Г— Ethernet port (RJ45) 10/100/1000 Mbps, teaming-capable, two independent controllers: Intel Jacksonville i219‑LM and Intel Springville i210‑AT

2 Г— Ethernet port (RJ45) 10/100/1000 Mbps, electrically isolated, teaming-capable, two independent controllers: Intel WGI217LM and Intel WGI210IT

2 Г— Ethernet port (RJ45) 10/100/1000 Mbps, electrically isolated, teaming-capable, two independent controllers: Intel WGI217LM and Intel WGI210IT

Plant bus interface module (single station/server), alternatives

• BCE

Ethernet network adapter RJ45 10/100/1000 Mbps (PCIe x1)

Ethernet network adapter RJ45 10/100/1000 Mbps (PCIe x1)

Ethernet network adapter RJ45 10/100/1000 Mbps (PCIe x1)

• IE

CP 1623 communication module (PCIe x1)

CP 1623 communication module (PCIe x1)

CP 1623 communication module (PCIe x1)

USB 3.0

6 channels, 900 mA high current (≤ 3 A in total), super speed

• 4 Г— at rear
• 2 Г— at front

4 channels, 500 mA high current, super speed

• 2 Г— at rear
• 1 Г— at front
• 1 Г— internal, with mechanical locking, e.g. for USB dongle

4 channels, 500 mA high current, super speed

• 2 Г— at rear
• 1 Г— at front
• 1 Г— internal, with mechanical locking, e.g. for USB dongle

USB 2.0

5 channels, 500 mA high current, high speed

• 4 Г— at rear
• 1 Г— internal, with mechanical locking, e.g. for USB dongle

3 channels, 500 mA high current, high speed

• 2 Г— at rear
• 1 Г— at front

3 channels, 500 mA high current, high speed

• 2 Г— at rear
• 1 Г— at front

Serial (COM)

1 Г— COM1 (V.24), 9‑pin sub‑D female connector

1 Г— COM1 (V.24), 9‑pin sub‑D male connector

1 Г— COM1 (V.24), 9‑pin sub‑D male connector

Audio

Realtek ALC671, 6‑channel DAC support;
1 Г— Line In; 1 Г— Micro In; 1 Г— Line Out (2 W into 4 О©)

1 Г— Micro In; 1 Г— Line Out/headphones (2 Г— 0.5 W/8 О©); IDT 92HD81HD

1 Г— Micro In; 1 Г— Line Out/headphones (2 Г— 0.5 W/8 О©); IDT 92HD81HD

DisplayPort

Yes, 2 Г—

Yes, 2 Г—

Yes, 2 Г—

DVI

1 × DVI‑D for digital connection of a monitor

1 Г— DVI-I for digital connection of a monitor

1 Г— DVI-I for digital connection of a monitor

Multi-monitor interface

2 monitors:

Integral interfaces: 1 Г— DVI and 1 Г— DVI via DisplayPort DVI adapter or 2 Г— via DisplayPort

3 or 4 monitors:

Onboard interfaces (2 Г— DisplayPort) + Dual Head PCIe x16 graphics card (2 Г— DisplayPort) combined, DVI via additional adapter cable

2 monitors:

Integral interfaces: 1 Г— DVI and 1 Г— DVI via DisplayPort DVI adapter

3 or 4 monitors:

Onboard interfaces (2 Г— DisplayPort) + Dual Head PCIe x16 graphics card (2 Г— DisplayPort) combined, DVI via additional adapter cable

2 monitors:

Integral interfaces: 1 Г— DVI and 1 Г— DVI via DisplayPort DVI adapter

3 or 4 monitors:

Onboard interfaces (2 Г— DisplayPort) + Dual Head PCIe x16 graphics card (2 Г— DisplayPort) combined, DVI via additional adapter cable

Keyboard

1 Г— PS/2

1 Г— PS/2

1 Г— PS/2

Mouse

1 Г— PS/2

1 Г— PS/2

1 Г— PS/2

Operating systems and diagnostics software

ES/OS single station

Windows 10 IoT Enterprise LTSB 2015 64-bit, multi-language (English, German, French, Italian, Spanish, Chinese)

Windows 10 IoT Enterprise LTSB 2015 64-bit, multi-language (English, German, French, Italian, Spanish, Chinese)

Windows 10 IoT Enterprise LTSB 2015 64-bit, multi-language (English, German, French, Italian, Spanish, Chinese)

OS server

Windows Server 2012 R2 Standard 64-bit including 5 CAL, multi-language (German, English, French, Italian, Spanish, Chinese)

Windows Server 2012 R2 Standard 64-bit including 5 CAL, multi-language (German, English, French, Italian, Spanish, Chinese)

Windows Server 2012 R2 Standard 64-bit including 5 CAL, multi-language (German, English, French, Italian, Spanish, Chinese)

OS client

Windows 10 IoT Enterprise LTSB 2015 64-bit, multi-language (English, German, French, Italian, Spanish, Chinese)

Windows 10 IoT Enterprise LTSB 2015 64-bit, multi-language (English, German, French, Italian, Spanish, Chinese)

--

System tested SIMATIC Industrial Software

SIMATIC IPC DiagMonitor integrated in pre-installation

SIMATIC IPC DiagMonitor integrated in pre-installation

SIMATIC IPC DiagMonitor integrated in pre-installation

Monitoring and diagnostics functions

Watchdog

• Monitoring of program execution
• Monitoring time adjustable in the software
• Restart can be configured for faults

• Monitoring of program execution
• Monitoring time adjustable in the software
• Restart can be configured for faults

• Monitoring of program execution
• Monitoring time adjustable in the software
• Restart can be configured for faults

Temperature

High/low violation of permitted operating temperature

Violation of permissible operating temperature

Violation of permissible operating temperature

Fans

Speed monitoring for

• Front fan
• Processor fan
• Fan on drive cage
• Fan of single, non-redundant power supply

Speed monitoring for

• Front fan
• Processor fan
• Power supply fan

Speed monitoring for

• Front fan
• Processor fan
• Power supply fan

Battery

Two-stage monitoring; service life following first warning at least 1 month

Two-stage monitoring; service life following first warning at least 1 month

Two-stage monitoring; service life following first warning at least 1 month

Drives

SMART messages of hard disks; RAID states "Normal", "Degraded" and "Rebuild"

SMART messages of hard disks; RAID states "Normal", "Degraded" and "Rebuild"

SMART messages of hard disks; RAID states "Normal", "Degraded" and "Rebuild"

Indicators (front LEDs)

• POWER (operating state)
• TEMP (temperature status)
• FAN (fan status)
• HDD (hard disk activity)
• HDD0/1/2/3 alarm (RAID status messages)

• POWER (device switched on)
• HDD (hard disk activity)
• ETHERNET 1, ETHERNET 2 (Ethernet status)
• WATCHDOG (ready/fault signal)
• TEMP (temperature status)
• FAN (fan/temperature monitoring)
• HDD0/1 ALARM (RAID status messages)

• POWER (device switched on)
• ETHERNET 1, ETHERNET 2 (Ethernet status)
• WATCHDOG (ready/fault signal)
• TEMP (temperature status)
• FAN (fan/temperature monitoring)
• HDD0/1/2 ALARM (RAID status messages) and HDD | HDD3 ALARM (hard disk activity and RAID status message)

Safety

Protection class

Protection class I in accordance with IEC 61140

Protection class I in accordance with IEC 61140

Protection class I in accordance with IEC 61140

Safety directives

IEC 60950-1;
EN 60950-1;
UL 60950-1;
CSA C22.2 No. 60950‑1‑07

IEC 60950-1;
EN 60950-1;
UL 60950-1;
CSA C22.2 No 60950‑1‑07

IEC 60950-1
EN 60950-1
UL 60950-1
CSA C22.2 No 60950‑1‑07

Noise emission

Operation

< 45 dB(A) according to DIN 45635
(40 dB(A) at 20 °C and Windows idle mode)

< 45 dB(A) at 25 °C according to EN ISO 7779 (without DVD drive)

< 55 dB(A) at 25 °C according to EN ISO 7779 (all drives in operation; high CPU loading)

< 45 dB(A) at 25 °C according to EN ISO 7779 (without DVD drive; low CPU loading)

Electromagnetic compatibility (EMC)

Interference emission

EN 61000‑6‑3;
EN 61000‑6‑4

CISPR 22, EN 55022 Class B; FCC Class A / EN 61000‑3‑2 Class D; EN 61000‑3‑3

EN 61000‑6‑3, FCC Class A;
EN 61000‑6‑4;
CISPR 22, EN 55022 Class B; EN 61000‑3‑2 Class D and EN 61000‑3‑3

EN 61000‑6‑3, FCC Class A;
EN 61000‑6‑4;
CISPR 22, EN 55022 Class B; EN 61000‑3‑2 Class D and EN 61000‑3‑3

Immunity to conducted interference on the supply lines

±2 kV (to IEC 61000‑4‑4, burst)
±1 kV (to IEC 61000‑4‑5, symmetrical surge)
±2 kV (to IEC 61000‑4‑5, asymmetrical surge)

±2 kV (to IEC 61000‑4‑4; burst)
±1 kV (to IEC 61000‑4‑5; symmetrical surge)
±2 kV (to IEC 61000‑4‑5; asymmetrical surge)

±2 kV (to IEC 61000‑4‑4; burst)
±1 kV (to IEC 61000‑4‑5; symmetrical surge)
±2 kV (to IEC 61000‑4‑5; asymmetrical surge)

Immunity to interference on signal lines

±1 kV (to IEC 61000‑4‑4; burst; length < 30 m)
±2 kV (to IEC 61000‑4‑4; burst; length > 30 m)
±2 kV (to IEC 61000‑4‑5; surge; length > 30 m)

±1 kV (to IEC 61000‑4‑4; burst; length < 30 m)
±2 kV (to IEC 61000‑4‑4; burst; length > 30 m)
±2 kV (to IEC 61000‑4‑5; length > 30 m)

±1 kV (to IEC 61000‑4‑4; burst; length < 30 m)
±2 kV (to IEC 61000‑4‑4; burst; length > 30 m)
±2 kV (to IEC 61000‑4‑5; surge; length > 30 m)

Immunity to static discharge

±4 kV contact discharge (according to IEC 61000‑4‑2)
±8 kV atmospheric discharge (according to IEC 61000‑4‑2)

±6 kV contact discharge (according to IEC 61000‑4‑2)
±8 kV atmospheric discharge (according to IEC 61000‑4‑2)

±6 kV contact discharge (according to IEC 61000‑4‑2)
±8 kV atmospheric discharge (according to IEC 61000‑4‑2)

Immunity to radio frequency interference

1 V/m, 2 вЂ¦ 2.7 GHz, 80% AM (to IEC 61000‑4‑3)

3 V/m, 1.4 вЂ¦ 2 GHz, 80% AM (to IEC 61000‑4‑3)

10 V/m, 80 вЂ¦ 1000 MHz, 80% AM (to IEC 61000‑4‑3)

10 V, 150 kHz вЂ¦ 80 MHz, 80% AM (to IEC 61000‑4‑6)

3 V/m, 2 вЂ¦ 2.7 GHz, 80 % AM (to IEC 61000‑4‑3)

10 V/m, 80 вЂ¦ 1 000 MHz and 1.4 вЂ¦ 2 GHz, 80 % AM (to IEC 6100‑4‑3)

10 V, 10 kHz ... 80 MHz, 80 % AM (to IEC 61000‑4‑6)

3 V/m, 2 вЂ¦ 2.7 GHz, 80 % AM (to IEC 61000‑4‑3)

10 V/m, 80 вЂ¦ 1 000 MHz and 1.4 вЂ¦ 2 GHz, 80 % AM (to IEC 6100‑4‑3)

10 V, 10 kHz ... 80 MHz, 80 % AM (to IEC 61000‑4‑6)

Magnetic field

30 A/m, 50 Hz/60 Hz (according to IEC 61000‑4‑8)

100 A/m, 50 Hz/60 Hz (to IEC 61000‑4‑8)

100 A/m, 50 Hz/60 Hz (to IEC 61000‑4‑8)

Climatic conditions

Temperature

Tested according to IEC 60068‑2‑2, IEC 60068‑2‑1, IEC 60068‑2‑14

Tested according to IEC 60068‑2‑2, IEC 60068‑2-1, IEC 60068‑2‑14

Tested according to IEC 60068‑2‑2, IEC 60068‑2‑1, IEC 60068‑2‑14

• Operation

+5 … +35 °C (without restriction)

0 to +40 °C (no DVD burner operation)¹⁾

Gradient: ≤ 10 K/h, no condensation

¹⁾ Power dissipation of the expansion modules in total max. 80 W

+0 to +35 °C (without restriction)

0 to +40 °C (without hardware RAID controller)¹⁾

0 to +45 °C (without DVD burner, without hardware RAID controller)¹⁾

0 to +50 °C (without DVD burner, without hardware RAID controller, no HDD operation in removable drive bay)

Gradient: max. 10 °C/h, no condensation

¹⁾ Power dissipation of the expansion modules in total max. 55 W

0 to +35 °C (with hardware RAID controller)

0 to +45 °C (without DVD burner)

0 to +50 °C (without DVD burner, max. 3 removable drive bays)¹⁾

Gradient: max. 10 °C/h, no condensation

¹⁾ Power dissipation of the expansion modules in total max. 30 W

• Storage/transport

-20 … +60 °C

Gradient: max. 2 K/h, no condensation

-20 … +60 °C

Gradient: max. 20 °C/h, no condensation

-20 … +60 °C

Gradient: max. 20 °C/h, no condensation

Relative humidity

Tested according to IEC 60068‑2‑78, IEC 60068‑2‑30

Tested according to IEC 60068‑2‑78, IEC 60068‑2‑30

Tested according to IEC 60068‑2‑78, IEC 60068‑2‑30

• Operation

5 ... 85% at 30 °C (no condensation)

Gradient: max. 10 K/h (no condensation)

5 … 80 % at 25 °C (no condensation)

Gradient: max. 10 °C/h (no condensation)

5 … 80 % at 25 °C (no condensation)

Gradient: max. 10 °C/h (no condensation)

• Storage/transport

5 ... 95% at 25 ... 55 °C (no condensation)

Gradient: ≤ 20 K/h (no condensation)

5 … 95 % at 25 °C (no condensation)

Gradient: max. 20 °C/h (no condensation)

5 … 95 % at 25 °C (no condensation)

Gradient: max. 20 °C/h (no condensation)

Atmospheric pressure

• Operation

1080 ... 689 hPa
(corresponds to a height of ‑1 000 ... 3 000 m)

1080 ... 795 hPa
(corresponds to a height of ‑1 000 ... 2 000 m)

1080 ... 795 hPa
(corresponds to a height of ‑1 000 ... 2 000 m)

• Storage/transport

1080 ... 660 hPa
(corresponds to a height of ‑1 000 ... 3 500 m)

1080 ... 660 hPa
(corresponds to a height of ‑1 000 ... 3 500 m)

1080 ... 660 hPa
(corresponds to a height of ‑1 000 ... 3 500 m)

Mechanical environmental conditions

Vibrations

Tested according to IEC 60068‑2‑6, 10 cycles

Tested according to IEC 60068‑2‑6, 10 cycles

Tested according to IEC 60068‑2‑6, 10 cycles

• Operation

20 … 58 Hz: Amplitude 0.015 mm;
58 … 200 Hz: 2 m/sІ (approx. 0.2 g)

Note:
No mechanical loads when using hard disks in removable trays and during DVD burning process.

10 … 58 Hz: Amplitude 0.0375 mm;
58 ... 500 Hz: 4.9 m/sІ (approx. 0.5 g)

Note:
No mechanical loads when using hard disks in removable drive bay and during DVD burning process.

10 … 58 Hz: Amplitude 0.0375 mm¹⁾;
58 ... 500 Hz: 4.9 m/sІ (approx. 0.5 g)¹⁾

Note:
No mechanical loads when using hard disks in removable drive bay and during DVD burning process.

¹⁾ With HDD mounting on side panel and assembly of device using telescopic rails max. 0.019 mm at 10 вЂ¦ 58 Hz; max. 3 m/sІ at 58 вЂ¦ 500 Hz

• Storage/transport

5 вЂ¦ 8.51 Hz: Amplitude 3.5 mm;
8.51 … 500 Hz: 9.8 m/sІ

5 … 9 Hz: Amplitude 3.5 mm;
9 … 500 Hz: 9.8 m/sІ

5 … 9 Hz: Amplitude 3.5 mm;
9 … 500 Hz: 9.8 m/sІ

Shock resistance

Tested according to IEC 60068‑2‑27

Tested according to IEC 60068‑2‑27,
IEC 60068‑2‑29

Tested according to IEC 60068‑2‑27,
IEC 60068‑2‑29

• Operation

Half sine: 9.8 m/sІ, 20 ms (approx. 1 g), 100 shocks per axis

Note:
No mechanical loads when using hard disks in removable trays and during DVD burning process.

Half sine: 50 m/sІ, 30 ms (approx. 5 g), 100 shocks per axis

Note:
No mechanical loads when using hard disks in removable drive bay and during DVD burning process.

Half sine: 50 m/sІ, 30 ms (approx. 5 g), 100 shocks per axis¹⁾

Note:
No mechanical loads when using hard disks in removable drive bay and during DVD burning process.

¹⁾ With HDD mounting on side panel and assembly of device using telescopic rails max. 0.019 mm at 10 вЂ¦ 58 Hz; max. 3 m/sІ at 58 вЂ¦ 500 Hz

• Storage/transport

Half sine: 250 m/sІ, 6 ms, 1000 shocks per axis

Half sine: 250 m/sІ, 6 ms, 1000 shocks per axis

Half sine: 250 m/sІ, 6 ms, 1000 shocks per axis

Approvals, standards

CE in conformity with 2004/108/EC, 2006/95/EC

Yes

Yes

Yes

Industrial area of application

• Interference emission

EN 61000‑6‑4:2007 + A1:2011

EN 61000‑6‑4:2007 + A1:2011

EN 61000‑6‑4:2007 + A1:2011

• Noise immunity

EN 61000‑6‑2:2005

EN 61000‑6‑2:2005

EN 61000‑6‑2:2005

Area of application: Residential, business, trade, small enterprise

• Interference emission

EN 61000‑6‑3:2007 + A1:2011

EN 61000‑6‑3:2007 + A1:2011

EN 61000‑6‑3:2007 + A1:2011

• Noise immunity

EN 61000‑6‑1:2007

EN 61000‑6‑1:2007

EN 61000‑6‑1:2007

cULus:

• 60950‑1, File No. E11 5352
• CAN/CSA-C22.2 No. 60950‑1‑07 (I.T.E.)

Yes

Yes

Yes

USA: FCC Rules, Part 15, Class A

Yes

Yes

Yes

Canada: ICES-003, Class B; NMB‑003, Class B

Yes

Yes

Yes

Australia/New Zealand: EN 61000‑6‑3:2007

Yes

Yes

Yes

Korea: Korean Certification (KC Mark)

Yes

Yes

Yes

EAC (Eurasian Conformity)

Yes

Yes

Yes

Special features

Quality assurance according to ISO 9001:2008

Yes

Yes

Yes

Power supply

Nominal supply voltage (U_N)

Single power supply unit:

• 100 вЂ¦ 240 V AC (‑15%, +10%)

Redundant power supply unit:

• 2 Г— 100 вЂ¦ 240 V AC (‑15%, +10%)

Single power supply unit:

• 100 вЂ¦ 240 V AC (‑15%, +10%)

Redundant power supply unit:

• 2 Г— 100 вЂ¦ 240 V AC (‑15%, +10%)

Single power supply unit:

• 100 вЂ¦ 240 V AC (‑15%, +10%)

Redundant power supply unit:

• 2 Г— 100 вЂ¦ 240 V AC (‑15%, +10%)

Frequency

50 … 60 Hz (min. 47 Hz, max. 63 Hz, sinusoidal)

50 … 60 Hz (min. 47 Hz, max. 63 Hz, sinusoidal)

50 … 60 Hz (min. 47 Hz, max. 63 Hz, sinusoidal)

Short-term voltage dip

• 20 ms for 230 W
  (max. 10 events per hour; recovery time ≥ 1 s) with single power supply unit
• 20 ms for 240 W
  (≤ 10 events per hour; recovery time ≥ 1 s) with redundant power supply unit

20 ms at 93 V
(max. 10 events per hour; min. recovery time 1 s)

20 ms at 93 V
(max. 10 events per hour; min. recovery time 1 s)

Power consumption at 230 W secondary (maximum configuration)

• 260 W max. at 90% efficiency with single power supply unit
• 270 W max. at 85% efficiency with redundant power supply unit

240 W max. at 80 % efficiency with single or redundant power supply unit

• 270 W max. at 80 % efficiency with single power supply unit
• 300 W max. at 70 % efficiency with redundant power supply unit

AC input current

Single power supply unit:

• Continuous current up to 6 A at 100 V; up to 3 A at 240 V
• Up to 80 A for 3.6 ms during startup

Redundant power supply unit:

• Continuous current up to 5 A at 100 V; up to 2.5 A at 240 V
• Up to 210 A per module for 1.65 ms during startup

• Continuous current up to 6 A
• Up to 30 A for 5 ms during startup

• Continuous current up to 7 A
• Up to 30 A for 5 ms during startup

Max. current output (DC)

Single power supply unit:

• +5 V: 25 A; +3.3 V: 20 A (in total up to 190 W)
• +12 V: 14 A; +12 V: 11 A
• -12 V: 0.1 A
• +5 V_aux: 2 A

Redundant power supply unit:

• +5 V: 20 A; +3.3 V: 20 A (in total up to 100 W)
• +12 V: 16 A; +12 V: 16 A
• -12 V: 0.5 A
• +5 V_aux: 3 A

Total sum of all voltages max. 230 W

• +5 V: 30 A; +3.3 V: 28 A (in total up to 160 W)
• +12 V: 15 A
• -12 V: 0.5 A
• -5 V: 0.5 A
• +5 V_aux: 2 A

Total sum of all voltages max. 190 W

• +5 V: 26 A; +3.3 V: 24 A (in total up to 190 W)
• +12 V: 15 A; +12 V: 15 A
• -12 V: 0.2 A
• +5 V_aux: 2 A

Total sum of all voltages max. 210 W

Dimensions and weights

Installation dimensions (W Г— H Г— D) in mm

433.5 Г— 176.5 Г— 445.5

430.4 Г— 88.1 Г— 444.6

430.4 Г— 177.4 Г— 444.4

Weight (depending on configuration)

15 … 23 kg

10 … 14 kg

16 … 23 kg