Hardware configuration | |
Number of modules per CPU | 1 |
Ambient conditions | |
Ambient temperature during operation | |
| -40 °C; = Tmin |
| 70 °C; = Tmax |
Extended ambient conditions | |
| Tmin ... Tmax at 1080 hPa ... 795 hPa (-1000 m ... +2000 m) // Tmin ... (Tmax - 10K) at 795 hPa ... 658 hPa (+2000 m ... +3500 m) // Tmin ... (Tmax - 20K) at 658 hPa ... 540 hPa (+3500 m ... +5000 m) |
Relative humidity | |
| 100 %; RH incl. condensation/frost (no commissioning under condensation conditions) |
Resistance | |
| Yes; Class 3B2 mold, fungus and dry rot spores (with the exception of fauna). The supplied connector covers must remain on the unused interfaces during operation! |
| Yes; Class 3C4 incl. salt spray according to EN 60068-2-52 (degree of severity 3). The supplied connector covers must remain on the unused interfaces during operation! |
| Yes; Class 3S4 incl. sand, dust. The supplied connector covers must remain on the unused interfaces during operation! |
Dimensions | |
Width | 35 mm |
Height | 119.5 mm |
Depth | 75 mm |
Weights | |
Weight, approx. | 100 g |
